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1 ? fn6364.0 ISL3159E 15kv esd protected, +125 c, 40mbps, 5v, profibus ? , full fail-safe, rs-485/rs-422 transceivers intersil?s ISL3159E is a 15kv iec61000 esd protected, 5v powered, single transceiver that meets both the rs-485 and rs-422 standards for balanced communication. it also features the larger output voltage and higher data rate - up to 40mbps - required by high speed profibus applications, and is offered in industrial and extended industrial (-40c to +125c) temperature rang es. the low bus currents (+220 a/-150 a) present a ?1/5 unit load? to the rs-485 bus, thus allowing up to 160 transceivers on the network without violating the rs-485 specificat ion?s load limit, and without using repeaters. t his transceiver requires a 5v 10% tolerance supply, and delivers at least a 2.1v differen tial output voltage over this supply range. this translates into better noise immunity (data integrity), longer reach, or the ability to drive up to six 120 terminations in ?star? or other non-standard bus topologies, at the exceptional 40mbps data rate. scsi applications benefit from the isl3159?s low receiver and transmitter part-to-part skews, which make it perfect for high speed parallel applications where large numbers of bits must be simultaneously captured. the low bit-to-bit skew eases the timing constraints on the data latching signal. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or terminated but undriven. rx outputs feature high drive levels (typically >30ma @ v ol = 1v) to ease the design of optically isolated interfaces. hot plug circuitry ensures that the tx and rx outputs remain in a high impedance state while the power supply stabilizes. driver (tx) outputs are short circuit protected, even for voltages exceeding the power supply voltage. additionally, on-chip thermal shutdown circuitry disables the tx outputs to prevent damage if power dissipation becomes excessive. features ? iec61000 esd protection on rs-485 i/o pins . . . 15kv - class 3 hbm esd level on all other pins . . . . . . >9kv ? large differential v out . . . . . . . . . . . . . . . 2.8v into 54 better noise immunity, or drive up to 6 terminations ? high data rates . . . . . . . . . . . . . . . . . . . . . up to 40mbps ? specified for +125c operation ? 11/13ns (max) tx/rx propagation delays; 1.5ns (max) skew ? 1/5 unit load allows up to 160 devices on the bus ? full fail-safe (open, shor ted, terminat ed/undriven) receiver ? high rx i ol to drive opto-couplers for isolated applications ? hot plug - tx and rx outputs remain three-state during power-up ? low quiescent supply current . . . . . . . . . . . . . . . . . 4ma ? low current shutdown mode. . . . . . . . . . . . . . . . . . . 1 a ? -7v to +12v common mode input voltage range ? three-state rx and tx outputs ? operates from a single +5v supply (10% tolerance) ? current limiting and thermal shutdown for driver overload protection ? pb-free plus anneal available (rohs compliant) applications ?profibus ? dp and fms networks ? scsi ?fast 40? drivers and receivers ? motor controller/position encoder systems ? factory automation ? field bus networks ? security networks ? building environmental control systems ? industrial/process control networks data sheet july 26, 2007 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2007. all rights reserved all other trademarks mentioned are the property of their respective owners.
2 fn6364.0 july 26, 2007 ordering information part number (notes 1, 2) part marking temp. range (c) package (pb-free) pkg. dwg. # ISL3159Eibz 3159 eibz -40 to +85 8 ld soic m8.15 ISL3159Eiuz 3159z -40 to +85 8 ld msop m8.118 ISL3159Eirz 159z -40 to +85 10 ld dfn l10.3x3c ISL3159Efbz 3159 efbz -40 to +125 8 ld soic m8.15 ISL3159Efuz 159fz -40 to +125 8 ld msop m8.118 ISL3159Efrz 59fz -40 to +125 10 ld dfn l10.3x3c notes: 1. add ?-t? suffix for tape and reel. please refer to tb347 for details on reel specifications. 2. intersil pb-free plus anneal products empl oy special pb-free material sets; molding compounds/die attach materials and 100% m atte tin plate termination finish, which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free p roducts are msl classified at pb-free peak reflow tem peratures that meet or exceed the pb-free requirements of ipc/jedec j std-020. pinouts ISL3159E (8 ld soic, msop) top view ISL3159E (10 ld dfn) top view ro re de di 1 2 3 4 8 7 6 5 v cc b/z a/y gnd d r 2 3 4 1 5 9 8 7 10 6 ro re de di nc v cc nc b/z a/y gnd truth table transmitting inputs outputs re de di b/z a/y x1101 x1010 0 0 x high-z high-z 1 0 x high-z * high-z * note: *shutdown mode truth table receiving inputs output re de a-b ro 00 -0.05v 1 00 -0.2v 0 0 0 inputs open/shorted 1 1 1 x high-z 10 x high-z * note: *shutdown mode ISL3159E
3 fn6364.0 july 26, 2007 pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a and b are unconnected (floating) or shorted, or connected to a terminated bus that is undriven. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. if the rx enable function isn?t required, connect re directly to gnd. de driver output enable. the driver outputs, y and z, are enabled by bringing de high. they are high impedance when de is low. i f the tx enable function isn?t requ ired, connect de to v cc through a 1k or greater resistor. di driver input. a low on di forces output y low and output z hi gh. similarly, a high on di forces output y high and output z lo w. gnd ground connection. this is also th e potential of the dfn thermal pad. a/y 15kv iec61000 esd protected rs-485/422 level, noninverting receiver input and noninverting driver outpu t. pin is an input (a) if de = 0; pin is an output (y) if de = 1. b/z 15kv iec61000 esd protected rs-485/422 level, inverting receiver input and inverting driver output. pin is an input (b) if de = 0; pin is an output (z) if de = 1. v cc system power supply input (4.5v to 5.5v). nc no connection. typical operating circuit ISL3159E 0.1 f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v 0.1 f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v r t r t soic and msop pin numbers shown ISL3159E
4 fn6364.0 july 26, 2007 absolute maximum rati ngs thermal information v cc to gnd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di, de, re . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v input/output voltages a/y, b/z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9v to +13v ro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range ISL3159Ef . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +125c ISL3159Ei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c thermal resistance (typical) ja (c/w) 8 ld soic package (note 3) . . . . . . . . . . . . . . . . . . 105 8 ld msop package (note 3) . . . . . . . . . . . . . . . . . 140 10 ld dfn package (note 4). . . . . . . . . . . . . . . . . . 75 maximum junction temperature (plastic package) . . . . . . +150c maximum storage temperature range . . . . . . . . . .-65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. note: 3. ja is measured with the component mounted on a high effective therma l conductivity test board in free air. see tech brief tb379 f or details. 4. ja is measured in free air with the component mounted on a high ef fective thermal conductivity te st board with ?direct attach? fe atures. see tech brief tb379. electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c, (note 5) parameter symbol test conditions temp (c) min (note 15) typ max (note 15) units dc characteristics driver differential v out v od no load full - - v cc r l = 100 (rs-422) (figure 1a) full 2.6 3.4 - v r l = 54 (rs-485) (figure 1a) i suffix full 2.1 2.8 v cc v f suffix, (note 14) full 2.1 2.8 v cc v r l = 60 , -7v v cm 12v (figure 1b), (note 14) full 1.9 2.7 - v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a), (note 14) full - 2 3 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.01 0.2 v logic input high voltage v ih di, de, re full 2 - - v logic input low voltage v il di, de, re full - - 0.8 v logic input current i in1 di = de = re = 0v or v cc full -2 - 2 a input current (a/y, b/z) i in2 de = 0v, v cc = 0v or 5.5v v in = 12v full - - 220 a v in = -7v full -160 - - a driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 7) full - - 250 ma differential capacitance c d a/y to b/z 25 - 9 - pf receiver differential threshold voltage v th -7v v cm 12v full -200 - -50 mv receiver input hysteresis v th v cm = 0v 25 - 28 - mv receiver output high voltage v oh i o = -8ma, v id = -50mv full v cc - 0.5 - - v ISL3159E
5 fn6364.0 july 26, 2007 receiver output low voltage v ol i o = +10ma, v id = -200mv full - - 0.4 v receiver output low current i ol v ol = 1v, v id = -200mv full 25 40 - ma three-state (high impedance) receiver output current i ozr 0.4v v o 2.4v full -1 0.015 1 a receiver input resistance r in -7v v cm 12v full 54 80 - k receiver short-circuit current i osr 0v v o v cc full 20 - 110 ma supply current no-load supply current (note 6) i cc di = de = 0v or v cc full - 2.6 4 ma shutdown supply current i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.05 1 a esd performance rs-485 pins (a/y, b/z) iec61000-4-2, air-gap discharge method 25 - 15 - kv iec61000-4-2, contact discharge method 25 - 8-kv human body model, from bus pins to gnd 25 - 16.5 - kv all pins hbm, per mil-std-883 method 3015 25 - > 9- kv machine model 25 - > 400 - v driver switching characteristics maximum data rate f max v od 1.5v, r d = 54 , c l = 100pf (figure 4) full 40 - - mbps driver differential output delay t dd r d = 54 , c d = 50pf (figure 2) full - 8 12 ns driver differential output skew t skew r d = 54 , c d = 50pf (figure 2) full - 0.5 1.5 ns prop delay part-to-part skew t skp-p r d = 54 , c d = 50pf (figure 2), (note 13) full - - 4 ns driver differential rise or fall time t r , t f r d = 54 , c d = 50pf (figure 2) full 2 5 8 ns driver enable to output high t zh r l = 110 , c l = 50pf, sw = gnd (figure 3), (note 8) full - 13 20 ns driver enable to output low t zl r l = 110 , c l = 50pf, sw = v cc (figure 3), (note 8) full - 11 20 ns driver enable time skew t enskew |t zh (y or z) - t zl (z or y)| full - 2.5 - ns driver disable from output high t hz r l = 110 , c l = 50pf, sw = gnd (figure 3), full - 14 20 ns driver disable from output low t lz r l = 110 , c l = 50pf, sw = v cc (figure 3), full - 12 20 ns driver disable time skew t disskew |t hz (y or z) - t lz (z or y)| full - 3 - ns time to shutdown t shdn (note 10) full 60 - 600 ns driver enable from shutdown to output high t zh(shdn) r l = 110 , c l = 50pf, sw = gnd (figure 3), (notes 10, 11) full - - 1000 ns driver enable from shutdown to output low t zl(shdn) r l = 110 , c l = 50pf, sw = v cc (figure 3), (notes 10, 11) full - - 1000 ns receiver switching characteristics maximum data rate f max v id = 1.5v full 40 - - mbps receiver input to output delay t plh , t phl (figure 5) full - 9 13 ns receiver skew | t plh - t phl |t skd (figure 5) full - 0 1.5 ns prop delay part-to-part skew t skp-p (figure 5), (note 13) full - - 4 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 9) full - - 12 ns electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c, (note 5) (continued) parameter symbol test conditions temp (c) min (note 15) typ max (note 15) units ISL3159E
6 fn6364.0 july 26, 2007 receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 9) full - - 12 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - - 12 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - - 12 ns time to shutdown t shdn (note 10) full 60 - 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 10, 12) full - - 1000 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 10, 12) full - - 1000 ns notes: 5. all currents into device pins are positiv e; all currents out of device pins are negat ive. all voltages are referenced to devi ce ground unless otherwise specified. 6. supply current specification is va lid for loaded drivers when de = 0v. 7. applies to peak current. see ?typical pe rformance curves? for more information. 8. because of the shutdown feature, keep re = 0 to prevent the device from entering shdn. 9. because of the shutdown feature, the re signal high time must be short enough (typically <100ns) to prevent the device from entering shdn. 10. these ic?s are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. if the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. see ? low-power shutdown mode? section. 11. keep re = vcc, and set the de signal low time >700ns to ensure that the device enters shdn. 12. set the re signal high time >700ns to ens ure that the device enters shdn. 13. this is the part-to-part skew between any two units tested with identical test conditions (temperature, v cc , etc.). 14. v cc = 5v 5% 15. parts are 100% tested at +25c. over temperature limits established by charac terization and are not production tested. test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c, (note 5) (continued) parameter symbol test conditions temp (c) min (note 15) typ max (note 15) units d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v ISL3159E
7 fn6364.0 july 26, 2007 figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times figure 4a. test circuit figure 4b. measurement points test circuits and waveforms (continued) d de di v cc signal generator c d r d z y out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y - z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw t hz y/z x 1/0 gnd t lz y/z x 0/1 v cc t zh y/z 0 (note 8) 1/0 gnd t zl y/z 0 (note 8) 0/1 v cc t hz(shdn) y/z 1 (note 11) 1/0 gnd t lz(shdn) y/z 1 (note 11) 0/1 v cc signal generator 110 50pf out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.5v t hz out (y, z) v cc v ol v ol + 0.5v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) (note 10) 50% 50% (note 10) (note 10) d de di v cc signal generator z y v od + - 54 c l c l 3v 0v diff out (y - z) +v od -v od di 0v ISL3159E
8 fn6364.0 july 26, 2007 figure 4. driver data rate figure 5a. test circuit figure 5b. measurement points figure 5. receiver propagation delay figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times test circuits and waveforms (continued) signal generator r ro re a b +1.5v 15pf ro +3v 0v t plh 1.5v 1.5v v cc 0v 1.7v 1.7v t phl a 1k v cc gnd sw parameter de a sw t hz 0 +1.5v gnd t lz 0-1.5vv cc t zh (note 9) 0 +1.5v gnd t zl (note 9) 0 -1.5v v cc t hz(shdn) (note 12) 0 +1.5v gnd t lz(shdn) (note 12) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.5v t hz ro v cc v ol 1.5v v ol + 0.5v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) (note 10) (note 10) (note 10) ISL3159E
9 fn6364.0 july 26, 2007 application information rs-485 and rs-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one unit load devices (any mix of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 spec requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for runs as long as 4000? (~1200m), so the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver (rx) features this transceiver utilizes a di fferential input receiver for maximum noise immunity and common mode rejection. input sensitivity is 200mv, as required by the rs422 and rs-485 specifications. receiver inputs function with common mode voltages as great as 7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks, or industrial environments, where induced voltages are a realistic concern. the receiver input resistance of 50k surpasses the rs-422 spec of 4k , and is five times the rs-485 ?unit load? (ul) requirement of 12k minimum. thus, the ISL3159E is known as a ?one-fifth ul? transceiver, and there can be up to 160 devices on the rs-485 bus while still complying with the rs-485 loading specification. the receiver is a ?full fail-saf e? version that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). rx outputs deliver large low state currents (typically >30ma) at v ol = 1v (to ease the design of optically coupled isolated networks). receivers easily meet the 40mbps data rate supported by the driver, and the receiver output is tri-statable via the active low re input. driver (tx) features the rs-485/rs-422 driver is a di fferential output device that delivers at least 2.1v across a 54 load (rs-485/ profibus), and at least 2.6v across a 100 load (rs-422) even with v cc = 4.5v. the drivers feature low propagation delay skew to maximize bit width, and to minimize emi. outputs of the drivers are not slew rate limited, so faster output transition times allow data rates of at least 40mbps. driver outputs are tri-statable via the active high de input. for parallel applications, bit-to-bit skews between any two ISL3159E transmitter and receiver pairs are guaranteed to be no worse than 8ns (4ns max for any two tx, 4ns max for any two rx). high v od improves noise immunity and flexibility the ISL3159E driver design deliv ers larger differential output voltages (v od ) than the rs-485 stand ard requires, or than most rs-485 transmitters can deliver. the minimum 2.1v v od guarantees at least 600mv more noise immunity than networks built using standard 1.5v v od transmitters. another advantage of the large v od is the ability to drive more than two bus terminations, which allows for utilizing the ISL3159E in ?star? and other multi-terminated, ?non-standard? network topol ogies. figure 8, details the transmitter?s v od vs i out characteristic, and includes load lines for four (30 ) and six (20 ) 120 terminations. the figure shows that the driver typically delivers 1.9/1.5v into 4/6 terminations, even at +85 c. the rs-485 standard requires a minimum 1.5v v od into two terminations, but the ISL3159E typically delivers rs-485 voltage levels with 2x to 3x the number of terminations. esd protection all pins on the ISL3159E include class 3 (>9kv) human body model (hbm) esd prot ection structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced structur es allowing them to survive esd events in excess of 16.5kv hbm and 15kv iec61000-4-2. the rs-485 pins are particularly vulnerable to esd strikes because they typically connect to an exposed port on the exterior of the finished product. simply touching the port pins, or co nnecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the de vice whether or not it is powered up, and without degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are ex posed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pi n-to-pin combination. the iec61000 standard?s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this dev ice?s rs-485 pins allows the ISL3159E
10 fn6364.0 july 26, 2007 design of equipment meeting leve l 4 criteria without the need for additional board level protection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is more difficult to obtain repeatable results. the ISL3159E rs-485 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kv. the rs-485 pins of the ISL3159E survive 8kv contact discharges. hot plug function when a piece of equipment powers up, there is a period of time where the processor or as ic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. to avoid this scenario, the ISL3159E incorporates a ?hot plug? function. circuitry monitoring v cc ensures that, during power up and power down, the tx and rx outputs remain disabled, regardless of the state of de and re , if v cc is less than ~3.2v. this gives the processor/asic a chance to stabilize and drive the rs-485 control lines to the proper states. data rate, cables , and terminations twisted pair is the cable of choice for rs-485, rs-422, and profibus networks. twisted pair cables tend to pick up noise and other electromagnet ically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ics. according to guidelines in the rs-422 and profibus specifications, networks operating at data rates in excess of 3mbps should be limited to cabl e lengths of 100m (328 ft) or less, and the profibus specif ication recommends that the more expensive ?type a? (22awg) cable be used. the ISL3159E?s large differential output swing, fast transition times, and high drive-current output stages allow operation even at 40mbps over standard ?cat5? cables in excess of 100m (328 ft). figure 17 details the ISL3159E performance at this condition, with a 120 termination resistor at both the driver and the receiver ends. no te that the differential signal delivered to the receiver at the end of the cable (a-b) still exceeds 1v, so even longer cables could be driven if lower noise margins are acceptable. of course, jitter or some other criteria may limit the network to shorter cable lengths than those discussed here. if more noise margin is desired, shorter cables produce a larger receiver input signal as illustrated in figure 16. perfo rmance should be even better if the ?type a? cable is utilized. the ISL3159E may also be used at slower data rates over longer cables, but there are so me limitations. the rx is optimized for high speed operation, so its output may glitch if the rx input differential transition times are too slow. keeping the transition times below 500ns, (which equates to the tx driving a 1000? (305m) ca t 5 cable) yields excellent performance over the full operating temperature range. to minimize reflections, proper termination is imperative when using this high data rate transceiver. in point-to-point, or point- to-multipoint (single driver on bus) networks, the main cable should be terminated in its char acteristic impedance (typically 120 for ?cat5?, and 220 for ?type a?) at the end farthest from the driver. in multi- receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. multipoint (mul ti-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. built-in driver overload protection as stated previously, the rs-4 85 specification requires that drivers survive worst case bus contentions undamaged. these transmitters meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. the driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the rs-485 specificat ion, even at the common mode voltage range extremes. in the event of a major short circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. this eliminates the power dissipation, allowing the die to cool. the drivers automatically reenable after the die temperature drops about figure 7. hot plug performance (ISL3159E) vs isl83088e without hot plug circuitry time (40 s/div) v cc receiver output (v) driver y output (v) 2.5 5.0 2.5 5.0 v cc (v) r l = 1k ro 0 2.5 5.0 0 0 a / y r l = 1k 3.1v 3.3v de, di = v cc ISL3159E ISL3159E re = gnd ISL3159E
11 fn6364.0 july 26, 2007 15 degrees. if the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. receivers stay operational during thermal shutdown. low power shutdown mode this bicmos transceiver uses a fraction of the power required by their bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent i cc to a 50na trickle. it enters shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and the receiver for le ss than 60ns guarantees that the transceiver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 8, 9, 10, 11 and 12, at the end of th e electrical specification table on page 6, for more information. typical performance curves v cc = 5v, t a = +25c; unless otherwise specified figure 8. driver output current vs differential output voltage figure 9. driver differential output voltage vs temperature figure 10. driver output current vs short circuit voltage figure 11. supply current vs temperature differential output voltage (v) driver output current (ma) 0 10 20 30 40 50 60 70 80 90 100 110 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 +25c +85c +125c r d = 30 r d = 54 r d = 100 r d = 20 -40 -15 10 35 60 85 110 temperature (c) differential output voltage (v) r d = 54 r d = 100 125 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 output voltage (v) -7 -6 -4 -2 0 2 4 6 8 10 12 output current (ma) -150 -100 -50 0 50 100 150 200 y or z = high y or z = low -40 -15 10 35 60 85 110 125 temperature (c) i cc (ma) 2.30 2.35 2.40 2.45 2.50 2.55 de = v cc , re = x or de = gnd, re = gnd ISL3159E
12 fn6364.0 july 26, 2007 figure 12. driver differential propagation delay vs temperature figure 13. driver differential skew vs temperature figure 14. driver and receiver waveforms figure 15. driver and receiver waveforms figure 16. driver and receiver waveforms driving 100 feet (31 meters) of cat5 cable (double terminated with 120 ) figure 17. driver and receiver waveforms driving 350 feet (107 meters) of cat5 cable (double terminated with 120 ) typical performance curves v cc = 5v, t a = +25c; unless otherwise specified (continued) -40 -15 10 35 60 85 110 125 temperature (c) propagation delay (ns) t plh t phl 7.0 7.2 7.4 7.6 7.8 8.0 8.2 8.4 8.6 8.8 9.0 -40 -15 10 35 60 85 110 125 temperature (c) skew (ns) |t plh - t phl | 0.3 0.4 0.5 0.6 0.7 0.8 0.9 time (5ns / div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro -3 2 3 -1 0 1 -2 y-z time (5ns / div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro -3 -2 -1 0 1 2 3 y-z time (10ns/div) -3.0 receiver output (v) 1.5 3.0 -1.5 0 0 5.0 receiver input (v) 0 5 driver input (v) di = 40mbps ro driver+cable delay (~156ns) a - b time (10ns/div) -3.0 receiver output (v) 1.5 3.0 -1.5 0 a - b 0 5.0 receiver input (v) 0 5 driver input (v) ro driver+cable delay (~480ns) di = 40mbps ISL3159E
13 fn6364.0 july 26, 2007 figure 18. receiver output current vs receiver output voltage die characteristics substrate and dfn thermal pad potential (powered up): gnd transistor count: 768 process: si gate bicmos typical performance curves v cc = 5v, t a = +25c; unless otherwise specified (continued) receiver output voltage (v) receiver output current (ma) 0 10 20 30 40 50 60 70 v oh , +25c v oh , +85c v ol , +25c v ol , +85c v oh , +125c v ol , +125c 01 2 3 4 5 ISL3159E
14 fn6364.0 july 26, 2007 mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (0.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only. l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m8.118 (jedec mo-187aa) 8 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.026 bsc 0.65 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n8 87 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 0 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 2 01/03 ISL3159E
15 fn6364.0 july 26, 2007 ISL3159E dual flat no-lead plastic package (dfn) // nx (b) section "c-c" for odd terminal/side e cc 5 c l terminal tip (a1) bottom view a 6 area index c c 0.10 0.08 side view 0.10 2x e a b c 0.10 d top view cb 2x 6 8 area index nx l e2 e2/2 ref. e n (nd-1)xe (datum a) (datum b) 5 0.10 8 7 d2 b a c n-1 12 plane seating c a a3 nx b d2/2 nx k 9 l m l10.3x3c 10 lead dual flat no-lead plastic package symbol millimeters notes min nominal max a 0.85 0.90 0.95 - a1 - - 0.05 - a3 0.20 ref - b 0.20 0.25 0.30 5, 8 d 3.00 bsc - d2 2.33 2.38 2.43 7, 8 e 3.00 bsc - e2 1.59 1.64 1.69 7, 8 e 0.50 bsc - k0.20 - - - l 0.35 0.40 0.45 8 n102 nd 5 3 rev. 1 4/06 notes: 1. dimensioning and tolerancing conform to asme y14.5-1994. 2. n is the number of terminals. 3. nd refers to the number of terminals on d. 4. all dimensions are in millim eters. angles are in degrees. 5. dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or mark feature. 7. dimensions d2 and e2 are fo r the exposed pads which provide improved electrical and thermal performance. 8. nominal dimensions are provided to assist with pcb land pattern design efforts, see intersil technical brief tb389. 9. compliant to jedec mo-229-weed-3 except for dimensions e2 & d2.
16 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6364.0 july 26, 2007 ISL3159E small outline plast ic packages (soic) index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. m8.15 (jedec ms-012-aa issue c) 8 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.1890 0.1968 4.80 5.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n8 87 0 8 0 8 - rev. 1 6/05

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